Ultrasonic Bonding Frame

Ultrasonic Bonding Frame

Ultrasonic bonding frame that works at 40 kHz

 

Description of the Ultrasonic Bonding Frame

 

Our Ultrasonic bonding frame can be used with both analogue and digital generators with power varying from 200 up to 800 W.

 

This ultrasonic structure is designed to be installed into textile looms and stenters.

 

Its sonotrode and special pattern counter wheel allow users to solder synthetic fabrics and make a cut for edge trimming with a mechanical blade across the center of the binding track.

APPLICAZIONI

  • tessile
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